A | 8月24日消息，美光HBM设计架构研究员拉古·斯里拉马内尼在8月23日斯坦福大学举办的Hot Chips 2026半导体会议上警告，内存墙依然存在，且情况还在恶化。 (ECNS) -- The 17th Beijing Olympic City Sports Culture Festival opened on Friday at the Beijing Olympic Museum, featuring more than 20 activities centered on the city’s Olympic culture. Beijing made history as the first city in the world to host both the Summer and Winter Olympic Games, with the 2008 Beijing Olympics and Paralympics and the 2022 Beijing Winter Olympics and Paralympics. Launched in 2010, the annual festival aims to preserve Olympic legacies and promote the Olympic spirit through community sports, youth education, exhibitions and exchanges among Olympic cities. This year’s program includes emerging international sports, the Beijing Zhangjiakou sports culture and tourism area, and the Beijing International Sports Film Week. The Olympic City Summer Plaza will feature Winter Olympic exhibits and an Italy-themed program showcasing the culture of the host country of the upcoming Milan-Cortina Winter Olympics. Participants from different countries and regions will share experiences in preserving Olympic legacies and promoting international exchanges. (By Helen Mo, intern Liu Shuangjing) 
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所谓内存墙，是指GPU速度不断提升，但存储数据的高带宽内存却无法跟上其速度而导致的瓶颈。 会议展示的最新HBM封装技术上，两颗GPU与八颗12层HBM4集成于一体，其中约90%半导体面积都用于存储，存储面积是GPU的8倍多。
B | 芯片内部空间几乎全被存储占据，这正是用面积换带宽所付出的代价，也是内存墙问题日益严峻的直观体现。 拉古指出，AI加速器计算性能以每两年3倍速度发展，但同期HBM发展速度不到每两年2倍。这解释了高带宽内存为何还是喂不饱GPU，无论计算设备速度多快，数据通道狭窄终将因供给过慢而停滞。
C | 硬件上，当前HBM制造相同存储容量消耗的晶圆数量约为普通DDR5的3倍。拉古强调，技术升级越快芯片尺寸越大、堆叠层数越多，这一差距还在扩大，内存行业将持续面临短缺。 散热方面，HBM是多层堆叠结构，底层产生的热量最多，但热量必须穿透所有堆叠层才能到达顶部的冷却系统，这使得散热效率大打折扣，液冷和芯片超薄技术正提供解决方案。 拉古表示，HBM的挑战需要内存厂商、GPU设计商、代工厂和封装厂商共同协作才能解决。
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